Introduction

A heat sink is a type of heat exchanger that transfers the heat created by a mechanical or electrical device to a fluid medium, allowing it to dissipate from the device. Heat sinks are commonly used to lower the temperature of CPUs and certain chipsets, such as RAM modules.
A heat sink, also commonly spelled heatsink, is an independent heat exchanger that transfers the heat generated by an electronic or mechanical device to a fluid medium, typically air or a liquid coolant, where it is dissipated away from the device, thereby enabling regulation of the device’s temperature.

Heat sinks are employed in personal computers to dissipate heat from central processing units (CPUs), graphics processing units (GPUs), as well as certain chipsets and random access memory (RAM) modules. Thermal sinks are employed with high-power semiconductor devices, such as power semiconductors and optoelectronics like lasers and light-emitting diodes (LEDs), when the heat dissipation capability of the component itself is insufficient to regulate its temperature.

Aim of the project : Design and analysis of 3 different types of heat sinks by using Ansys

The aim of the thesis is design and cost estimation of different heat sinks (rectangular, circular, square) and also calculating their performance values like efficiency and temperature distribution, heat flux values for 2 different materials (copper and al-alloy) after calculating all required results thesis can conclude with valid results and optimum model for real time boundary conditions, in this process solid works were used as design tool and Ansys were used as analyzing tool,